Electronic Packaging Materials And Their Properties Pdf
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- Electronic packaging and interconnection handbook
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- Electronic Packaging Materials and Their Properties
Not a MyNAP member yet? Register for a free account to start saving and receiving special member only perks. Below is the uncorrected machine-read text of this chapter, intended to provide our own search engines and external engines with highly rich, chapter-representative searchable text of each book. Adequate packaging has to be provided to build functional modules based on these devices, however. The primary issues to be considered in high-temperature electronic packaging are: 1 characterizing materials and their interactions at high temperatures, 2 minimizing mechanical stresses caused by thermal expansion mismatches, 3 providing a suitable path for heat dissipation, and 4 providing environmental protection.
Electronic packaging and interconnection handbook
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging.
Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips.
These packaging schemes are crucial to the overall reliability and performance of electronic systems. Professor Deborah D. We are always looking for ways to improve customer experience on Elsevier. We would like to ask you for a moment of your time to fill in a short questionnaire, at the end of your visit. If you decide to participate, a new browser tab will open so you can complete the survey after you have completed your visit to this website.
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Materials for Electronic Packaging
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering.
There are different requirements for digital and RF packages that translate into the need for unique materials for each application. The interconnecting and dielectric insulating requirements are presented for each application and the relevant material properties and characteristics are discussed. The fundamental material characteristics of materials are: dielectric constant, dielectric loss, thermal and electric conductivity, resistivity, moisture absorption, glass transition temperature, strength, time-dependent deformation creep , and fracture toughness. The material characteristics and properties are dependent upon how they are processed to form the electronic package, so the fundamentals of electronic packaging processes are discussed including wirebonding, solder interconnects, flip chip interconnects, underfill for flip chip and overmolding.
Electronic Packaging Materials and Their Properties
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Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
Aluminium packaging products can be stored in the coldest deep freeze and heated in the hottest oven.
The Journal of Electronic Packaging publishes papers that use experimental and theoretical analytical and computer-aided methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Read more Subscribe to our YouTube channel to see interviews with our Journal Editors discussing their research and vision for their journal. We also have a podcast series by Harry Dankowicz interviewing leading experts in a variety of Mechanical Engineering fields.
Electronic Packaging Materials and Their Properties. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:interconnectionsprinted circuit boardssubstratesencapsulantsdielectricsdie attach materialselectrical contactsthermal materialssoldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
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